|
Impedance:
|
50 OHM
|
|
Interface freq. max. (GHz):
|
18
|
Mechanical data
|
Number of matings:
|
500
|
|
Weight:
|
0,0301 kg
|
Enviromental and general data
|
Operation temperature:
|
-65 °C to +165 °C
|
|
2011/65/EC (RoHS):
|
|
Interface 1
|
Piece part
|
Base material
|
Plating / Color
|
|
Centre Contact
|
Copper Beryllium Alloy
|
Gold Plating (without Nickel underplating)
|
|
Outer Contact
|
Copper Beryllium Alloy
|
Gold Plating (without Nickel underplating)
|
|
Insulator
|
PFA / PTFE
|
|
|
Body
|
Brass
|
SUCOPLATE (R) Plating
|
|
Coupling Nut
|
Brass
|
SUCOPLATE (R) Plating
|
|
Interface 2
|
Piece part
|
Base material
|
Plating / Color
|
|
Centre Contact
|
Copper Beryllium Alloy
|
Gold Plating (without Nickel underplating)
|
|
Outer Contact
|
Copper Beryllium Alloy
|
Gold Plating (without Nickel underplating)
|
|
Insulator
|
PFA / PTFE
|
|
|
Body
|
Copper Beryllium Alloy
|
Gold Plating (without Nickel underplating)
|
|
Ordering information
|
Available packagings:
|
Single
|
